| ID | Name | CAS | Category | Last Update |
|---|---|---|---|---|
| 1 | Bottom filling adhesive, dysprosium material, bottom filling adhesive circuit board/BGA bottom filling adhesive one-component low-temperature curing/chip adhesive | Bottom filling adhesive, dysprosium material, bottom filling adhesive circuit board/BGA bottom filling adhesive one-component low-temperature curing/chip adhesive | Epoxy glue | 2023-04-27 18:30:20 |
| 2 | Liquid lens forming adhesive, Dysprosium 7816 lens forming adhesive, Mini LED chip packaging adhesive | Liquid lens forming adhesive, Dysprosium 7816 lens forming adhesive, Mini LED chip packaging adhesive | Epoxy glue | 2023-04-27 18:30:20 |